US 12,257,624 B2
Powder bed materials
John Samuel Dilip Jangam, Palo Alto, CA (US); Thomas Anthony, Palo Alto, CA (US); Krzysztof Nauka, Palo Alto, CA (US); and Kristopher J. Erickson, Palo Alto, CA (US)
Assigned to Hewlett-Packard Development Company, L.P., Spring, TX (US)
Filed by Hewlett-Packard Development Company, L.P., Spring, TX (US)
Filed on Dec. 9, 2023, as Appl. No. 18/534,610.
Application 18/534,610 is a continuation of application No. 16/605,423, granted, now 11,845,128, previously published as PCT/US2018/036615, filed on Jun. 8, 2018.
Prior Publication US 2024/0100597 A1, Mar. 28, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. B22F 10/14 (2021.01); B22F 1/05 (2022.01); B22F 1/142 (2022.01); B22F 9/04 (2006.01); B33Y 10/00 (2015.01); B33Y 70/00 (2020.01); B33Y 70/10 (2020.01); B29C 64/165 (2017.01)
CPC B22F 10/14 (2021.01) [B22F 1/05 (2022.01); B22F 1/142 (2022.01); B22F 9/04 (2013.01); B33Y 10/00 (2014.12); B33Y 70/00 (2014.12); B33Y 70/10 (2020.01); B22F 2009/043 (2013.01); B22F 2304/10 (2013.01); B29C 64/165 (2017.08)] 16 Claims
OG exemplary drawing
 
1. A material set, comprising:
a powder bed material comprising 80 wt % to 100 wt % metal particles having a D50 particle size distribution value from 4 μm to 150 μm,
wherein 80 wt % to 99 wt % of the metal particles are surface-activated metal particles to have i) an outer volume with increased structural defects compared to an inner volume and ii) an average surface grain density of 50,000 per mm2 to 5,000,000 per mm2;
and wherein a balance of the metal particles has an average surface grain density of 20,000 per mm2; and
a binder fluid to adhere a first portion of the powder bed material that is in contact with the binder fluid.