US 12,257,610 B2
Apparatus and method for wafer cleaning
Bo Chen Chen, Hsinchu (TW); Sheng-Wei Wu, Zhubei (TW); and Yung-Li Tsai, Houlong Town (TW)
Assigned to Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed on Jan. 26, 2024, as Appl. No. 18/424,589.
Application 18/424,589 is a division of application No. 17/875,658, filed on Jul. 28, 2022, granted, now 11,958,090.
Application 17/875,658 is a division of application No. 16/532,701, filed on Aug. 6, 2019, granted, now 11,766,703, issued on Sep. 26, 2023.
Claims priority of provisional application 62/764,651, filed on Aug. 15, 2018.
Prior Publication US 2024/0157412 A1, May 16, 2024
Int. Cl. B08B 7/04 (2006.01); A46B 13/02 (2006.01); B08B 1/12 (2024.01); B08B 1/20 (2024.01); B08B 1/32 (2024.01); B08B 3/04 (2006.01); H01L 21/02 (2006.01); H01L 21/67 (2006.01)
CPC B08B 7/04 (2013.01) [A46B 13/023 (2013.01); B08B 1/12 (2024.01); B08B 1/20 (2024.01); B08B 3/041 (2013.01); H01L 21/02057 (2013.01); H01L 21/67046 (2013.01); H01L 21/67051 (2013.01); B08B 1/32 (2024.01)] 20 Claims
OG exemplary drawing
 
17. An apparatus, comprising: a wafer holder configured to hold a wafer in different positions during different modes of operations: a nozzle configured to dispense a fluid on a first surface of the wafer; and a brush configured to vibrate while moving along a vertical direction during a first mode of operation; vibrate while moving along a horizontal direction during a second mode of operation; and clean a second surface of the wafer, wherein the brush comprises: bristles of different lengths and diameters disposed on a base structure, a pressure sensor configured to detect a pressure applied to the brush against the wafer, and a spray outlet comprising conductive layers of carbon nanostructures.