US 12,257,595 B2
Processing liquid supply device, substrate processing apparatus, and processing liquid supply method
Masaaki Furuya, Kanagawa (JP); Hiroaki Kobayashi, Kanagawa (JP); and Hideki Mori, Kanagawa (JP)
Assigned to SHIBAURA MECHATRONICS CORPORATION, Kanagawa (JP)
Filed by SHIBAURA MECHATRONICS CORPORATION, Kanagawa (JP)
Filed on Mar. 9, 2023, as Appl. No. 18/119,401.
Claims priority of application No. 2022-037353 (JP), filed on Mar. 10, 2022.
Prior Publication US 2023/0286013 A1, Sep. 14, 2023
Int. Cl. B05C 11/10 (2006.01)
CPC B05C 11/1007 (2013.01) [B05C 11/1036 (2013.01); B05C 11/1042 (2013.01); B05C 11/1047 (2013.01)] 9 Claims
OG exemplary drawing
 
1. A processing liquid supply device comprising;
a plurality of tanks each configured to store a processing liquid;
a supply path configured to connect the plurality of tanks so as to enable the processing liquid to pass between the plurality of tanks and to supply the processing liquid to a processing device that processes a substrate with the processing liquid, by sequentially passing through the plurality of tanks;
a heater configured to heat the processing liquid;
a diluter configured to dilute the processing liquid with a diluent;
a new-liquid supply configured to supply a new-processing liquid;
a common flow path through which the processing liquid of the plurality of tanks passes;
a switch configured to switch between the plurality of tanks so that at least a tank is selected from which the processing liquid passes to the common flow path;
a densitometer provided in the common flow path; and
a controller configured to cause the densitometer to measure a concentration of the processing liquid in each of the plurality of tanks while switching between the plurality of tanks by the switch, and to control at least one of the heater, the diluter, and the new-liquid supply so that the concentration of the processing liquid reaches a target value set in advance.