| CPC A63F 9/24 (2013.01) [A63F 13/211 (2014.09); A63F 13/235 (2014.09); A63F 13/30 (2014.09); A63F 13/332 (2014.09); A63F 13/35 (2014.09); A63F 13/54 (2014.09); A63H 3/28 (2013.01); A63H 5/00 (2013.01); A63H 33/042 (2013.01); A63H 33/08 (2013.01); A63H 33/26 (2013.01); B25J 9/1656 (2013.01); B25J 9/1694 (2013.01); G05B 15/02 (2013.01); G09B 5/06 (2013.01); G09B 17/003 (2013.01); G09B 19/00 (2013.01); G09B 19/0023 (2013.01); G09B 19/025 (2013.01); H01R 9/16 (2013.01); H01R 13/6691 (2013.01); H01R 13/7175 (2013.01); H01R 13/7177 (2013.01); H01R 24/64 (2013.01); H02J 1/00 (2013.01); H02J 1/001 (2020.01); H02J 3/00 (2013.01); H02J 13/00 (2013.01); H04L 5/14 (2013.01); H04L 12/2803 (2013.01); H04R 1/028 (2013.01); H04R 3/00 (2013.01); H04R 17/00 (2013.01); H04W 4/80 (2018.02); A63F 2009/247 (2013.01); A63F 2250/50 (2013.01); H01R 2107/00 (2013.01); H04W 84/042 (2013.01); H04W 84/12 (2013.01); Y10S 901/09 (2013.01)] | 43 Claims |

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1. A method for activating a payload in response to sensing a first physical phenomenon and for over-the-air wireless communication with a device, for use with a first module that comprises a first enclosure that houses a sensor, a second module that comprises a second enclosure that houses a first payload, and a third module that comprises a third enclosure that houses a firmware and a processor, the method comprising:
producing, by the sensor, an output signal responsive to the first physical phenomenon;
affecting, by the first payload a second physical phenomenon responsive to a first payload activation signal;
executing, by the processor, the firmware;
receiving, by the processor, the sensor output signal from the first module;
transmitting, by the processor, the first payload activation signal to the second module; and
transmitting, by a wireless transmitter via an antenna a wireless signal,
wherein the third module is mechanically attachable to the first module and to the second module, and
wherein upon electrically connecting the first and third modules and electrically connecting the second and third modules, activating, by the processor, the first payload in response to the sensing of the first physical phenomenon.
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