US D1,018,664 S
Envelope
Wim Wouters, Herresbach (BE); Peter Pieraets, Leuven (BE); and Carlos Eduardo Diaz, Sint Jans Molenbeek (BE)
Filed by DS SMITH PACKAGING LTD, London (GB)
Filed on Jan. 5, 2022, as Appl. No. 35/515,936.
Int. Filing Date Jan. 5, 2022
Int. Reg. No. DM/219072
Int. Reg. Date Jan. 5, 2022
Int. Reg. Pub. Date Jan. 6, 2023
Term of patent 15 Years
LOC (14) Cl. 19 - 01
U.S. Cl. D19—3
OG exemplary drawing
 
The ornamental design for an envelope, as shown and described.