CPC H10K 10/471 (2023.02) [H10K 71/12 (2023.02)] | 9 Claims |
1. A fabrication method for an organic field-effect transistor, comprising:
providing a gate;
depositing a polymer material onto the gate and forming a dielectric layer;
performing a supercritical fluid treatment on the gate having the dielectric layer deposited;
depositing an organic semiconductor layer material on the dielectric layer having been processed, and forming an organic semiconductor layer; and
depositing an electrode layer material on the organic semiconductor layer, and forming an electrode layer;
wherein the step of performing the supercritical fluid treatment on the gate having the dielectric layer deposited further comprises:
adopting carbon dioxide as a fluid, placing the gate having the dielectric layer deposited into a reaction kettle, adding a water-removing agent, pressurizing the carbon dioxide to 1500-3000 psi before passing into the reaction kettle, raising a temperature of the reaction kettle to 60-120° C., and keeping for a process period of 30 minutes to 1 hour.
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