US 11,937,381 B2
Forming electrical interconnections using capillary microfluidics
Ankit Mahajan, Cupertino, CA (US); Mikhail L Pekurovsky, Bloomington, MN (US); Saagar A. Shah, Minneapolis, MN (US); Kayla C. Niccum, Maplewood, MN (US); Kara A. Meyers, Oakdale, MN (US); and Christopher G. Walker, Edina, MN (US)
Assigned to 3M INNOVATIVE PROPERTIES COMPANY, St. Paul, MN (US)
Appl. No. 17/309,699
Filed by 3M INNOVATIVE PROPERTIES COMPANY, St. Paul, MN (US)
PCT Filed Dec. 30, 2019, PCT No. PCT/IB2019/061450
§ 371(c)(1), (2) Date Jun. 15, 2021,
PCT Pub. No. WO2020/141445, PCT Pub. Date Jul. 9, 2020.
Claims priority of provisional application 62/787,133, filed on Dec. 31, 2018.
Prior Publication US 2022/0078918 A1, Mar. 10, 2022
Int. Cl. H05K 3/32 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01); H01R 12/62 (2011.01); H05K 3/12 (2006.01); H05K 3/36 (2006.01); H05K 3/40 (2006.01); H01R 4/04 (2006.01)
CPC H05K 3/321 (2013.01) [H01L 21/486 (2013.01); H01L 23/49827 (2013.01); H01L 23/4985 (2013.01); H01L 24/32 (2013.01); H01R 12/62 (2013.01); H05K 3/1258 (2013.01); H05K 3/1283 (2013.01); H05K 3/361 (2013.01); H05K 3/4069 (2013.01); H01L 2224/32235 (2013.01); H01R 4/04 (2013.01); H05K 2203/1545 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A method for manufacturing an electronic device, comprising:
providing a substrate with a first major surface comprising a microchannel, wherein the microchannel has a first end and a second end, wherein the second end of the microchannel terminates in a bore extending from the first major surface of the substrate to a second major surface of the substrate opposite the first major surface;
dispensing a conductive liquid in the microchannel to cause the conductive liquid to move, primarily by capillary pressure, in a first direction toward the first end of the microchannel and in a second direction toward the second end of the microchannel; and
solidifying the conductive liquid to form an electrically conductive trace electrically connecting a first electronic device at the first end of the microchannel to a second electronic device at the second end of the microchannel, wherein the first electronic device is on the first major surface of the substrate and the second electronic device is on the second major surface of the substrate and underlying the bore.