US 11,936,968 B2
Circuit board, an image sensor module, a lens driving device, and a camera module including the same
Hae Sik Kim, Seoul (KR); So Hee Choi, Seoul (KR); Jee Heum Paik, Seoul (KR); and Na Kyung Kwon, Seoul (KR)
Assigned to LG INNOTEK CO., LTD., Seoul (KR)
Filed by LG INNOTEK CO., LTD., Seoul (KR)
Filed on Apr. 21, 2022, as Appl. No. 17/726,135.
Claims priority of application No. 10-2021-0051997 (KR), filed on Apr. 21, 2021; application No. 10-2021-0065557 (KR), filed on May 21, 2021; and application No. 10-2021-0067575 (KR), filed on May 26, 2021.
Prior Publication US 2022/0353389 A1, Nov. 3, 2022
Int. Cl. H05K 1/18 (2006.01); H04N 23/54 (2023.01); H04N 23/57 (2023.01)
CPC H04N 23/54 (2023.01) [H04N 23/57 (2023.01); H05K 1/181 (2013.01); H05K 1/185 (2013.01); H05K 2201/0338 (2013.01); H05K 2201/09409 (2013.01); H05K 2201/10121 (2013.01); H05K 2201/10151 (2013.01); H05K 2201/10969 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A circuit board comprising:
an insulating portion; and
a pattern portion disposed on the insulating portion,
wherein the insulating portion includes:
a first insulating region, and
a second insulating region disposed outside the first insulating region and spaced apart from the first insulating region with a separation region therebetween;
wherein the pattern portion includes:
a first pattern portion for signal transmission; and
a second pattern portion including a dummy pattern separated from the first pattern portion,
wherein the first pattern portion includes:
a first terminal portion disposed on the first insulating region;
a second terminal portion disposed on the second insulating region; and
a connection portion disposed on the separation region and connecting between the first terminal portion and the second terminal portion,
wherein the second pattern portion includes:
a second-first pattern portion disposed on the first insulating region; and
a second-second pattern portion disposed on the second insulating region and separated from the second-first pattern portion.