US 11,936,430 B2
Board, optical module, OLT, and information processing method
Lei Zhou, Shenzhen (CN); Shiwei Nie, Dongguan (CN); Shengping Li, Shenzhen (CN); and Bo Gao, Shenzhen (CN)
Assigned to HUAWEI TECHNOLOGIES CO., LTD., Shenzhen (CN)
Filed by HUAWEI TECHNOLOGIES CO., LTD., Shenzhen (CN)
Filed on Dec. 13, 2022, as Appl. No. 18/065,281.
Application 18/065,281 is a continuation of application No. 17/244,298, filed on Apr. 29, 2021, granted, now 11,558,118.
Application 17/244,298 is a continuation of application No. PCT/CN2018/112890, filed on Oct. 31, 2018.
Prior Publication US 2023/0116204 A1, Apr. 13, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. H04B 10/27 (2013.01); H04J 14/00 (2006.01); H04L 25/03 (2006.01)
CPC H04B 10/27 (2013.01) [H04J 14/00 (2013.01); H04L 25/03878 (2013.01); H04J 2203/0046 (2013.01); H04J 2203/0051 (2013.01)] 20 Claims
OG exemplary drawing
 
16. An information processing method, comprising:
sending, by a MAC chip, first information to a DSP, wherein the first information comprises a first optical network unit (ONU) identifier;
receiving, by the DSP, the first information, and determining a first reference equalization parameter that is related to the first ONU identifier; and
setting an equalization parameter of an equalizer to the first reference equalization parameter.