US 11,936,088 B2
Co-firing of low firing temperature dielectric materials with high bismuth garnet ferrites for miniaturized isolators and circulators
Michael David Hill, Emmitsburg, MD (US); David Bowie Cruickshank, Rockville, MD (US); Jeffrey Alan Shunkwiler, Adamstown, MD (US); John Jianzhong Jiang, Leesburg, VA (US); David Martin Firor, Thurmont, MD (US); and Srinivas Polisetty, Frederick, MD (US)
Assigned to SKYWORKS SOLUTIONS, INC., Irvine, CA (US)
Filed by SKYWORKS SOLUTIONS, INC., Irvine, CA (US)
Filed on May 19, 2023, as Appl. No. 18/199,598.
Application 18/199,598 is a division of application No. 16/446,877, filed on Jun. 20, 2019, granted, now 11,699,836.
Claims priority of provisional application 62/687,984, filed on Jun. 21, 2018.
Prior Publication US 2023/0291085 A1, Sep. 14, 2023
Int. Cl. H01P 1/36 (2006.01); C01G 31/02 (2006.01); C04B 35/495 (2006.01); C04B 37/00 (2006.01); H01B 3/12 (2006.01); H01F 1/03 (2006.01); H01F 1/34 (2006.01); H01P 1/38 (2006.01)
CPC H01P 1/36 (2013.01) [C01G 31/02 (2013.01); C04B 35/495 (2013.01); C04B 37/001 (2013.01); H01B 3/12 (2013.01); H01F 1/0315 (2013.01); H01F 1/346 (2013.01); H01P 1/38 (2013.01); C01P 2006/40 (2013.01); C04B 2235/3217 (2013.01); C04B 2235/3225 (2013.01); C04B 2235/3232 (2013.01); C04B 2235/3239 (2013.01); C04B 2235/3298 (2013.01); C04B 2235/764 (2013.01); C04B 2235/765 (2013.01); C04B 2237/345 (2013.01); C04B 2237/84 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method of forming a composite material for use as an isolator or circulator in a radiofrequency device, the method comprising:
providing a low temperature fireable outer material, the low temperature fireable outer material having a garnet or scheelite structure;
inserting a high dielectric constant inner material within an aperture in the low temperature fireable outer material, the high dielectric constant inner material having a dielectric constant above 30; and
co-firing the lower temperature fireable outer material and the high dielectric constant inner material together at temperature between 650-900° C. to shrink the low temperature fireable outer material around an outer surface of the high dielectric constant inner material to form an integrated magnetic/dielectric assembly without the use of adhesive or glue.