US 11,935,861 B2
Underfill flow management in electronic assemblies
Frederick W. Atadana, Chandler, AZ (US); Taylor William Gaines, Chandler, AZ (US); Edvin Cetegen, Chandler, AZ (US); Wei Li, Chandler, AZ (US); Hsin-Yu Li, Chandler, AZ (US); and Tony Dambrauskas, Chandler, AZ (US)
Assigned to Intel Coropration, Santa Clara, CA (US)
Filed by Intel Corporation, Santa Clara, CA (US)
Filed on Apr. 29, 2020, as Appl. No. 16/862,287.
Prior Publication US 2021/0343677 A1, Nov. 4, 2021
Int. Cl. H01L 23/00 (2006.01); H01L 23/29 (2006.01); H01L 23/31 (2006.01)
CPC H01L 24/32 (2013.01) [H01L 23/293 (2013.01); H01L 23/3157 (2013.01); H01L 24/29 (2013.01); H01L 24/16 (2013.01); H01L 24/73 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/29191 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2924/0675 (2013.01); H01L 2924/0715 (2013.01)] 16 Claims
OG exemplary drawing
 
1. An electronic assembly, comprising:
a first component;
a second component;
an underfill on the first component and at least partially between the first component and the second component; and
a material at a surface of the first component, wherein the material is outside a footprint of the second component, and the underfill contacts the material with a contact angle greater than 50 degrees;
wherein the material includes a silicone, a polyurethane, a polyolefin, or an elastomer.