CPC H01L 24/17 (2013.01) [H01L 21/76877 (2013.01); H01L 21/76897 (2013.01); H01L 23/5226 (2013.01); H01L 24/09 (2013.01); H01L 24/11 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/0105 (2013.01)] | 22 Claims |
1. A method of forming an electronic package, comprising:
embedding a bridge substrate in a packaging substrate;
forming first vias to the bridge substrate;
forming second vias to electrical routing in the packaging substrate;
forming first conductive pads over the first vias, wherein the first conductive pads have a first surface area; and
forming second conductive pads over the second vias, wherein the second conductive pads have a second surface area that is greater than the first surface area.
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