US 11,935,856 B2
Semiconductor device having a redistribution layer
Jong Sik Paek, Incheon (KR); and Doo Hyun Park, Seongnam-si (KR)
Assigned to Amkor Technology Singapore Holding Pte. Ltd., Singapore (SG)
Filed by Amkor Technology Singapore Holding Pte. Ltd., Singapore (SG)
Filed on Jun. 21, 2021, as Appl. No. 17/352,657.
Application 17/352,657 is a continuation of application No. 16/044,164, filed on Jul. 24, 2018, granted, now 11,043,464.
Application 16/044,164 is a continuation of application No. 15/340,785, filed on Nov. 1, 2016, granted, now 10,032,740, issued on Jul. 24, 2018.
Application 15/340,785 is a continuation of application No. 14/313,724, filed on Jun. 24, 2014, granted, now 9,484,331, issued on Nov. 1, 2016.
Claims priority of application No. 10-2014-0012762 (KR), filed on Feb. 4, 2014.
Prior Publication US 2022/0059490 A1, Feb. 24, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 23/00 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 23/538 (2006.01); H01L 25/10 (2006.01)
CPC H01L 24/17 (2013.01) [H01L 21/56 (2013.01); H01L 21/568 (2013.01); H01L 23/3135 (2013.01); H01L 24/19 (2013.01); H01L 24/85 (2013.01); H01L 25/105 (2013.01); H01L 23/5389 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 24/81 (2013.01); H01L 24/92 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/131 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/45099 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73253 (2013.01); H01L 2224/73267 (2013.01); H01L 2224/81005 (2013.01); H01L 2224/81203 (2013.01); H01L 2224/81815 (2013.01); H01L 2224/85 (2013.01); H01L 2224/92125 (2013.01); H01L 2225/1011 (2013.01); H01L 2225/1023 (2013.01); H01L 2225/1035 (2013.01); H01L 2225/1041 (2013.01); H01L 2225/1058 (2013.01); H01L 2225/107 (2013.01); H01L 2924/00012 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/15331 (2013.01); H01L 2924/181 (2013.01); H01L 2924/18161 (2013.01); H01L 2924/18162 (2013.01); H01L 2924/19107 (2013.01); H01L 2924/3511 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A semiconductor device comprising:
a first redistribution layer comprising a first dielectric and a first conductive layer;
a semiconductor die mounted to and electrically connected to an upper side of the first redistribution layer, where the semiconductor die comprises a die bonding pad on a lower die side of the semiconductor die and over the upper side of the first redistribution layer, and where the die bonding pad electrically connects the semiconductor die to the first conductive layer of the first redistribution layer;
a lower encapsulant that covers a lower side of the first dielectric;
a conductive pillar on the first redistribution layer, where a lower end of the conductive pillar is electrically connected to the first conductive layer of the first redistribution layer, and the lower end of the conductive pillar is vertically lower than the die bonding pad;
an upper encapsulant that encapsulates the upper side of the first redistribution layer, the conductive pillar, and the semiconductor die, where the upper encapsulant comprises an upper encapsulant side facing away from the first redistribution layer and a lower encapsulant side facing toward the first redistribution layer;
a second conductive layer on the upper encapsulant side, where the second conductive layer is electrically connected to the first conductive layer of the first redistribution layer through the conductive pillar; and
a material underfilling directly vertically between the semiconductor die and the first redistribution layer,
wherein:
a first lateral side of the lower encapsulant is coplanar with a first lateral side of the upper encapsulant; and
a first lateral side of the first redistribution layer is coplanar with the first lateral side of the upper encapsulant.