US 11,935,772 B2
Apparatus for processing a substrate
Seohyun Kim, Hwaseong-si (KR); Younghoo Kim, Yongin-si (KR); Sangjine Park, Suwon-si (KR); Kuntack Lee, Suwon-si (KR); and Jihoon Jeong, Seongnam-si (KR)
Assigned to Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed by Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed on Jul. 21, 2021, as Appl. No. 17/381,507.
Claims priority of application No. 10-2020-0177260 (KR), filed on Dec. 17, 2020.
Prior Publication US 2022/0199440 A1, Jun. 23, 2022
Int. Cl. H01L 21/677 (2006.01)
CPC H01L 21/67703 (2013.01) [H01L 21/67739 (2013.01)] 18 Claims
OG exemplary drawing
 
1. An apparatus for processing a substrate, the apparatus comprising:
a wet chamber configured to perform a wet process on the substrate using a chemical;
a dry chamber adjacent the wet chamber and configured to dry the substrate processed by the wet chamber;
a first transfer robot configured to transfer the substrate between the wet chamber and the dry chamber; and
a shared shutter between the wet chamber and the dry chamber,
wherein the substrate is moved through a connection opening formed between the wet chamber and the dry chamber, and the shared shutter is configured to open and close the connection opening,
wherein the wet chamber and the dry chamber are arranged in a first direction,
wherein the first transfer robot is on an unloading region adjacent the dry chamber, and
wherein the first transfer robot is movable on the unloading region in a second direction perpendicular to the first direction.