	US 11,935,768 B2
	Device and method for attaching protective tape on semiconductor wafer
Karl Heinz Priewasser, Kirchheim b. Muenchen (DE); Ken Ikehata, Kashihara (JP); Yoshinori Kakinuma, Kashihara (JP); and Yosuke Ishimatsu, Kashihara (JP)
Assigned to DISCO HI-TEC EUROPE GMBH, Kirchheim b. Muenchen (DE); and TAKATORI CORPORATION, Kashihara (JP)
Appl. No. 17/049,381
Filed by DISCO HI-TEC EUROPE GMBH, Kirchheim b. Muenchen (DE); and TAKATORI CORPORATION, Kashihara (JP)
PCT Filed Apr. 24, 2018, PCT No. PCT/JP2018/016533 § 371(c)(1), (2) Date Oct. 21, 2020, PCT Pub. No. WO2019/207632, PCT Pub. Date Oct. 31, 2019.
Prior Publication US 2021/0249285 A1, Aug. 12, 2021
Int. Cl. B29C 65/00 (2006.01); B32B 37/06 (2006.01); B32B 37/10 (2006.01); B32B 37/12 (2006.01); H01L 21/67 (2006.01); H01L 21/683 (2006.01); B29C 65/50 (2006.01)

CPC H01L 21/67132 (2013.01) [B32B 37/06 (2013.01); B32B 37/10 (2013.01); B32B 37/1292 (2013.01); H01L 21/6836 (2013.01); B29C 65/50 (2013.01); B32B 2457/14 (2013.01)]

8 Claims

1. An application apparatus for applying a protective tape to a semiconductor wafer, comprising:

an application table configured to support the semiconductor wafer; and

a pressing member configured to press from above the protective tape on which a protective tape layer having an outer diameter smaller than an outer diameter of the semiconductor wafer is laminated, the protective tape being supplied onto the semiconductor wafer,

the pressing member including a first holder and a protective layer outer periphery retainer having a ring shape and that is held on an outer peripheral edge portion of the first holder,

the application of the protective tape to the semiconductor wafer being conducted only by pressing a peripheral portion of the protective layer of the protective tape toward the semiconductor wafer with the protective layer outer periphery retainer, and

the first holder configured to have a gap between itself and the protective layer when the protective tape is applied to the semiconductor wafer.