CPC H01G 4/224 (2013.01) [H01G 2/10 (2013.01); H01G 4/32 (2013.01)] | 69 Claims |
1. A method for forming an overmolded film capacitor comprising:
forming a working element comprising a first film layer with a first conductive layer on said first film layer and a second film layer with a second conductive layer on said second film layer wherein said first conductive layer and said second conductive layer form a capacitive couple;
forming a first lead in electrical contact with said first conductive layer and a second lead in electrical contact with said second conductive layer;
forming an inner overmold encasing said working element; and
forming an overmold directly on and encasing said inner overmold wherein said inner overmold comprises a thermoplastic resin with a Tg of no more than 20° C. and wherein said first lead and said second lead extend from said overmolding.
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