US 11,935,699 B2
Overmolded film capacitor
Evangelista Boni, Sasso Marconi (IT); Federico Fantini, Sasso Marcono (IT); Gabriele Piccinini, Sasso Marcono (IT); and Walter Bruno, Sasso Marcono (IT)
Assigned to KEMET Electronics Corporation, Fort Lauderdale, FL (US)
Filed by KEMET Electronics Corporation, Fort Lauderdale, FL (US)
Filed on Mar. 31, 2022, as Appl. No. 17/709,547.
Claims priority of provisional application 63/171,730, filed on Apr. 7, 2021.
Prior Publication US 2022/0328246 A1, Oct. 13, 2022
Int. Cl. H01G 4/224 (2006.01); H01G 2/10 (2006.01); H01G 4/32 (2006.01)
CPC H01G 4/224 (2013.01) [H01G 2/10 (2013.01); H01G 4/32 (2013.01)] 69 Claims
OG exemplary drawing
 
1. A method for forming an overmolded film capacitor comprising:
forming a working element comprising a first film layer with a first conductive layer on said first film layer and a second film layer with a second conductive layer on said second film layer wherein said first conductive layer and said second conductive layer form a capacitive couple;
forming a first lead in electrical contact with said first conductive layer and a second lead in electrical contact with said second conductive layer;
forming an inner overmold encasing said working element; and
forming an overmold directly on and encasing said inner overmold wherein said inner overmold comprises a thermoplastic resin with a Tg of no more than 20° C. and wherein said first lead and said second lead extend from said overmolding.