US 11,934,620 B2
Electronic apparatus and method of fabricating the same
Yanghee Kim, Yongin-si (KR); Jeongho Lee, Seoul (KR); Won Ho Kim, Seongnam-si (KR); Soyeon Park, Seoul (KR); Dong-Hyun Lee, Suwon-si (KR); and Hyungchul Lim, Cheonan-si (KR)
Assigned to Samsung Display Co., Ltd., Yongin-si (KR)
Filed by Samsung Display Co., Ltd., Yongin-si (KR)
Filed on May 7, 2020, as Appl. No. 16/869,432.
Claims priority of application No. 10-2019-0055215 (KR), filed on May 10, 2019.
Prior Publication US 2020/0356215 A1, Nov. 12, 2020
Int. Cl. G06F 3/044 (2006.01); H01L 27/12 (2006.01)
CPC G06F 3/0445 (2019.05) [G06F 3/0446 (2019.05); H01L 27/124 (2013.01); H01L 27/1259 (2013.01); G06F 2203/04103 (2013.01)] 13 Claims
OG exemplary drawing
 
1. An electronic apparatus, comprising:
a display unit; and
an input sensing unit on the display unit,
wherein:
the display unit comprises insulating layers, a signal line, a pad connected to an end portion of the signal line, and circuit elements; and
the insulating layers comprise a first insulating layer covering the circuit elements and exposing at least a portion of the circuit elements,
wherein the input sensing unit comprises:
a first conductive layer;
a second conductive layer including sensing patterns; and
a second insulating layer between the first conductive layer and the second conductive layer, the second insulating layer exposing at least a portion of the first conductive layer, and
wherein:
the display unit further comprises a first electrode, a second electrode, and a light emitting layer between the first and second electrodes;
the first insulating layer and the second insulating layer are disposed between the end portion of the signal line and the pad;
an insulating layer between the end portion of the signal line and the pad is defined as a pad insulating layer; and
a maximum thickness of the pad insulating layer is greater than a sum of a thickness of the first insulating layer and a thickness of the second insulating layer in an area overlapping the signal line.