US 11,934,237 B2
Hybrid motherboard cooling system for air-cooled servers
Ruslan Nagimov, Redmond, WA (US); Eric Clarence Peterson, Woodinville, WA (US); and Winston Allen Saunders, Seattle, WA (US)
Assigned to Microsoft Technology Licensing, LLC, Redmond, WA (US)
Filed by Microsoft Technology Licensing, LLC, Redmond, WA (US)
Filed on Jun. 28, 2021, as Appl. No. 17/361,277.
Prior Publication US 2022/0413570 A1, Dec. 29, 2022
Int. Cl. H05K 7/20 (2006.01); G06F 1/20 (2006.01)
CPC G06F 1/20 (2013.01) [H05K 7/202 (2013.01); H05K 7/203 (2013.01); H05K 7/20318 (2013.01); H05K 7/20327 (2013.01); G06F 2200/201 (2013.01)] 21 Claims
OG exemplary drawing
 
1. A coolant container subassembly for a hybrid cooling system, the coolant container subassembly comprising:
a coolant container comprising an upper portion and a lower portion, an upper cross-sectional area of the coolant container having a greater surface area than a lower cross-sectional area of the coolant container;
a lower surface on the lower portion of the coolant container, the lower surface being configured for attachment to a motherboard to form a hermetically sealed enclosure that encompasses a first computing component on the motherboard without encompassing a second computing component on the motherboard, the hermetically sealed enclosure being configured to retain dielectric working fluid in fluid communication with the first computing component;
an air-cooled heat sink; and
an upper surface on the upper portion of the coolant container, the upper surface being configured for attachment to the air-cooled heat sink such that the air-cooled heat sink is positioned to condense vapors formed from boiling of the dielectric working fluid and to cause condensed dielectric working fluid to return to a pool of the dielectric working fluid that comprises the first computing component.