CPC G06F 1/20 (2013.01) [H05K 7/202 (2013.01); H05K 7/203 (2013.01); H05K 7/20318 (2013.01); H05K 7/20327 (2013.01); G06F 2200/201 (2013.01)] | 21 Claims |
1. A coolant container subassembly for a hybrid cooling system, the coolant container subassembly comprising:
a coolant container comprising an upper portion and a lower portion, an upper cross-sectional area of the coolant container having a greater surface area than a lower cross-sectional area of the coolant container;
a lower surface on the lower portion of the coolant container, the lower surface being configured for attachment to a motherboard to form a hermetically sealed enclosure that encompasses a first computing component on the motherboard without encompassing a second computing component on the motherboard, the hermetically sealed enclosure being configured to retain dielectric working fluid in fluid communication with the first computing component;
an air-cooled heat sink; and
an upper surface on the upper portion of the coolant container, the upper surface being configured for attachment to the air-cooled heat sink such that the air-cooled heat sink is positioned to condense vapors formed from boiling of the dielectric working fluid and to cause condensed dielectric working fluid to return to a pool of the dielectric working fluid that comprises the first computing component.
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