US 11,932,959 B2
Copper plating solution and negative electrode composite current collector prepared using same
Jia Peng, Ningde (CN); Mingling Li, Ningde (CN); Xin Liu, Ningde (CN); and Qisen Huang, Ningde (CN)
Assigned to CONTEMPORARY AMPEREX TECHNOLOGY CO., LIMITED, Ningde (CN)
Filed by CONTEMPORARY AMPEREX TECHNOLOGY CO., LIMITED, Ningde (CN)
Filed on Sep. 1, 2022, as Appl. No. 17/901,101.
Application 17/901,101 is a continuation of application No. PCT/CN2021/126433, filed on Oct. 26, 2021.
Prior Publication US 2023/0132206 A1, Apr. 27, 2023
Int. Cl. C25D 3/38 (2006.01); C25D 17/10 (2006.01)
CPC C25D 3/38 (2013.01) [C25D 17/10 (2013.01)] 15 Claims
 
1. A copper plating solution for a composite current collector, comprising a leveling agent represented by a general formula (

OG Complex Work Unit Chemistry
wherein an anion X is F, Cl, or Br,
R1, R2, and R3 are each independently selected from O or S; and
R4, R5, and R6 are each independently selected from hydrogen, a substituted or unsubstituted alkyl, a substituted or unsubstituted vinyl, a substituted, or unsubstituted aqi, and a substituted or unsubstituted heteroaryl.