CPC C22C 38/54 (2013.01) [B22F 1/05 (2022.01); B22F 1/065 (2022.01); B22F 9/082 (2013.01); B23K 26/34 (2013.01); C22C 38/001 (2013.01); C22C 38/002 (2013.01); C22C 38/02 (2013.01); C22C 38/44 (2013.01); C22C 38/50 (2013.01); C22C 38/58 (2013.01); B22F 2301/35 (2013.01); B22F 2304/10 (2013.01)] | 5 Claims |
1. An ultra-high-speed laser cladding process using an iron-based metal powder, comprising:
machining a surface of substrate;
wiping the surface of substrate with acetone to remove surface grease;
carrying out laser cladding path planning according to a geometry of the surface of substrate,
formulating process parameters; and
using Computerized Numerical Control (CNC) machine tools to machine the repaired substrate surface to obtain the required size;
wherein a semiconductor laser cladding system is used to clad and repair the surface of substrate with the following process parameters: laser power 1500˜2500 W, spot diameter 0.8˜1.2 mm, powder feeding rate 2˜5 kg/h, laser scanning rate 330˜830 m/min, overlap rate 40%˜70%, and single layer cladding thickness 250˜500 μm, wherein a laser cladding head with an argon gas protection function is used, and wherein an argon gas flow rate of 8˜20 L/min is used,
wherein the iron-based metal powder comprises: C at 0.6˜1.0%, Cr at 18.0˜20.0%, at Ni 5.0˜6.5% at Mn 2.0˜4.0%, at Mo 1.0˜1.5%, Ti at 4.0˜6.0%, B at 1.0˜1.5%, N at 0.08˜0.15%, Si at ≤0.5%, P at ≤0.030%, S at ≤0.030%, balance of Fe and unavoidable impurities.
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