US 11,932,734 B2
Methods of recycling and reshaping thermosetting polymers and composites thereof
Hang Qi, Atlanta, GA (US); Kai Yu, Atlanta, GA (US); Qian Shi, Atlanta, GA (US); and Xiao Kuang, Atlanta, GA (US)
Assigned to Georgia Tech Research Corporation, Atlanta, GA (US)
Filed by Georgia Tech Research Corporation, Atlanta, GA (US)
Filed on Aug. 12, 2022, as Appl. No. 17/819,335.
Application 17/819,335 is a division of application No. 17/089,401, filed on Nov. 4, 2020, granted, now 11,421,095.
Application 17/089,401 is a division of application No. 16/314,549, granted, now 10,829,612, issued on Nov. 10, 2020, previously published as PCT/US2017/040596, filed on Jul. 3, 2017.
Claims priority of provisional application 62/357,642, filed on Jul. 1, 2016.
Prior Publication US 2022/0389185 A1, Dec. 8, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. C08J 11/04 (2006.01); C08F 4/16 (2006.01); C08G 63/195 (2006.01); C08J 5/04 (2006.01); C08J 5/12 (2006.01); C08J 5/24 (2006.01); C08J 11/24 (2006.01); C08K 5/103 (2006.01); C08K 7/14 (2006.01)
CPC C08J 11/24 (2013.01) [C08F 4/16 (2013.01); C08G 63/195 (2013.01); C08J 5/04 (2013.01); C08J 5/121 (2013.01); C08J 5/24 (2013.01); C08K 5/103 (2013.01); C08K 7/14 (2013.01); C08J 2363/00 (2013.01); C08J 2367/06 (2013.01)] 26 Claims
 
1. A method for chemically welding a first surface of a first substrate to a second surface of a second substrate, wherein both the first surface and the second surface include a thermoset polymer matrix, the method comprising
(a) contacting the first surface and the second surface with a small molecule solvent in the presence of a catalyst at a first elevated temperature for a first period of time;
(b) contacting the first surface and the second surface to form an interface;
(c) optionally applying pressure to the first substrate and second substrate, and
(d) evaporating the small molecule solvent.