US 11,931,986 B2
Laminate assembly with embedded conductive alloy elements
Vidyashankar Ramasastry Buravalla, Bangalore (IN)
Assigned to General Electric Company, Schenectady, NY (US)
Filed by GENERAL ELECTRIC COMPANY, Schenectady, NY (US)
Filed on Jan. 31, 2023, as Appl. No. 18/103,982.
Application 18/103,982 is a continuation of application No. 17/016,621, filed on Sep. 10, 2020, granted, now 11,565,505.
Prior Publication US 2023/0173790 A1, Jun. 8, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. B32B 15/04 (2006.01); B32B 5/26 (2006.01); B32B 27/06 (2006.01); B32B 27/12 (2006.01); B32B 37/18 (2006.01)
CPC B32B 15/043 (2013.01) [B32B 5/26 (2013.01); B32B 27/065 (2013.01); B32B 27/12 (2013.01); B32B 37/18 (2013.01); B32B 2307/202 (2013.01); B32B 2307/56 (2013.01); B32B 2311/005 (2013.01); B32B 2605/18 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A laminate assembly comprising:
a matrix layer having opposite first and second sides connected by opposite first and second edges, each of the first and second edges extending from the first side of the matrix layer to the opposite second side of the matrix layer; and
bowed strips of a conductive alloy disposed in the matrix layer between the first and second sides of the matrix layer, the bowed strips continuously extending through the matrix layer from the first edge to the opposite second edge.