CPC B06B 1/0622 (2013.01) [A61B 8/4483 (2013.01); G10K 11/002 (2013.01); H10N 30/063 (2023.02); H10N 30/302 (2023.02); H10N 30/872 (2023.02)] | 4 Claims |
1. A method of manufacturing an ultrasonic transducer assembly, comprising:
providing a wafer including:
a first array of ultrasonic transducer chips, each having a main surface comprising a plurality of ultrasound transducer elements and a plurality of first contacts for connecting to said ultrasound transducer elements;
a second array of contact chips, each having a further main surface comprising a plurality of second contacts for contacting a signal processing assembly; and
a sacrificial region separating the first array from the second array;
forming a flexible interconnect extending over said sacrificial region from the first contacts to the second contacts, the flexible interconnect comprising a plurality of conductive tracks, each conductive track connecting one of said first contacts to a second contact;
removing the sacrificial region to release the first array and the second array;
providing a backing material comprising ultrasound absorbing and/or scattering bodies;
providing the first array on a first surface of said backing material; and
providing the second array on a second surface of said backing material such that the flexible interconnect extends from the first array to the second array over said backing material.
|