US 12,256,626 B2
Nozzle-droplet combination techniques to deposit fluids in substrate locations within precise tolerances
Nahid Harjee, Sunnyvale, CA (US); Lucas D. Barkley, Lexington, KY (US); Christopher R. Hauf, Belmont, CA (US); Eliyahu Vronsky, Los Altos, CA (US); and Conor F. Madigan, San Francisco, CA (US)
Assigned to Kateeva, Inc., Newark, CA (US)
Filed by Kateeva, Inc., Newark, CA (US)
Filed on May 8, 2023, as Appl. No. 18/313,513.
Application 18/313,513 is a continuation of application No. 17/647,928, filed on Jan. 13, 2022, granted, now 11,678,561.
Application 17/647,928 is a continuation of application No. 16/947,880, filed on Aug. 21, 2020, granted, now 11,233,226, issued on Jan. 25, 2022.
Application 16/947,880 is a continuation of application No. 16/174,063, filed on Oct. 29, 2018, granted, now 10,784,472, issued on Sep. 22, 2020.
Application 16/174,063 is a continuation of application No. 15/361,845, filed on Nov. 28, 2016, granted, now 10,797,270, issued on Oct. 6, 2020.
Application 15/361,845 is a continuation of application No. 14/937,739, filed on Nov. 10, 2015, granted, now 9,537,119, issued on Jan. 3, 2017.
Application 14/937,739 is a continuation of application No. 14/680,960, filed on Apr. 7, 2015, granted, now 9,224,952, issued on Dec. 29, 2015.
Application 14/680,960 is a continuation of application No. 14/162,525, filed on Jan. 23, 2014, granted, now 9,010,899, issued on Apr. 21, 2015.
Application 14/162,525 is a continuation of application No. PCT/US2013/077720, filed on Dec. 24, 2013.
Claims priority of provisional application 61/920,715, filed on Dec. 24, 2013.
Claims priority of provisional application 61/898,769, filed on Nov. 1, 2013.
Claims priority of provisional application 61/857,298, filed on Jul. 23, 2013.
Claims priority of provisional application 61/842,351, filed on Jul. 2, 2013.
Claims priority of provisional application 61/822,855, filed on May 13, 2013.
Claims priority of provisional application 61/746,545, filed on Dec. 27, 2012.
Claims priority of application No. 102148330 (TW), filed on Dec. 26, 2013.
Prior Publication US 2023/0320184 A1, Oct. 5, 2023
Int. Cl. H10K 71/00 (2023.01); B41J 2/01 (2006.01); B41J 2/045 (2006.01); B41J 2/205 (2006.01); H10K 71/10 (2023.01); H10K 71/13 (2023.01)
CPC H10K 71/00 (2023.02) [B41J 2/01 (2013.01); B41J 2/0456 (2013.01); B41J 2/04581 (2013.01); B41J 2/04586 (2013.01); B41J 2/04588 (2013.01); B41J 2/04593 (2013.01); B41J 2/2054 (2013.01); H10K 71/135 (2023.02); H10K 71/191 (2023.02); H10K 71/811 (2023.02)] 20 Claims
OG exemplary drawing
 
1. A method of processing a substrate, comprising:
for each nozzle of a printhead for ejecting a liquid onto the substrate, receiving data representing an expected droplet volume produced by the nozzle in association with one or more waveforms;
receiving data representing a desired volume of the liquid to be deposited in each of a plurality of locations of the substrate;
for each location, obtaining a tolerance range for aggregate volume deposited in the location, the tolerance range surrounding the desired volume for the location;
for each location, selecting a plurality of combinations of nozzles and waveforms that can be used to deposit droplets of the liquid in the location such that the expected droplet volumes of each selected combination of nozzles and waveforms sum to a value within the tolerance range for the location;
from the selected combinations, identifying a combination of nozzles and waveforms that maximizes a number of locations receiving the liquid in one scan of the printhead;
depositing droplets at the locations using the corresponding identified nozzle and waveform combination for each location to form a liquid layer; and
processing the liquid layer to form a solid layer on the substrate.