US 12,256,616 B2
Display device and method of manufacturing display device
Hyuneok Shin, Gwacheon-si (KR); Hyunwoo Kang, Yeosu-si (KR); Hyunah Sung, Suwon-si (KR); Dokeun Song, Yongin-si (KR); Sukyoung Yang, Hwaseong-si (KR); Yunjong Yeo, Hwaseong-si (KR); Dongmin Lee, Anyang-si (KR); Donghyeok Lee, Yongin-si (KR); and Shin Il Choi, Hwaseong-si (KR)
Assigned to SAMSUNG DISPLAY CO., LTD., Gyeonggi-Do (KR)
Filed by Samsung Display Co., Ltd., Yongin-si (KR)
Filed on Feb. 14, 2024, as Appl. No. 18/441,694.
Application 18/441,694 is a division of application No. 17/398,336, filed on Aug. 10, 2021, granted, now 11,943,982.
Claims priority of application No. 10-2020-0154473 (KR), filed on Nov. 18, 2020.
Prior Publication US 2024/0224679 A1, Jul. 4, 2024
Int. Cl. H10K 59/131 (2023.01); H10K 59/12 (2023.01)
CPC H10K 59/1315 (2023.02) [H10K 59/1201 (2023.02)] 4 Claims
OG exemplary drawing
 
1. A method of manufacturing a display device, the method comprising:
forming a buffer layer on a base substrate;
forming an active layer on the buffer layer;
forming a first gate insulation layer on the active layer;
forming a first gate line on the first gate insulation layer, the first gate line including molybdenum;
forming a second gate insulation layer on the first gate line;
forming a second gate line on the second gate insulation layer, the second gate line including aluminum or an aluminum alloy;
forming an insulation interlayer on the second gate line;
simultaneously defining an active contact hole which exposes the active layer in the insulation interlayer, the second gate insulation layer, and the first gate insulation layer, a first gate contact hole which exposes the first gate line in the insulation interlayer and the second gate insulation layer, and a first opening which overlaps a bendable area in the insulation interlayer, the second gate insulation layer, the first gate insulation layer, and a first portion of the buffer layer; and
simultaneously defining a second gate contact hole which exposes the second gate line in the insulation interlayer and a second opening which overlaps the bendable area in a second portion of the buffer layer and a portion of the base substrate.