| CPC H10K 19/10 (2023.02) [H01G 9/0029 (2013.01); H01G 9/0036 (2013.01); H01G 9/025 (2013.01); H01G 9/04 (2013.01); H01G 9/07 (2013.01); H01G 9/22 (2013.01); H01G 9/26 (2013.01); H01G 9/28 (2013.01); H01M 10/4257 (2013.01); H10K 10/46 (2023.02); H10K 10/82 (2023.02); H10K 85/1135 (2023.02); H01L 31/053 (2014.12); H01M 2010/4271 (2013.01)] | 22 Claims |

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1. A method, comprising:
depositing a first insulator layer on a current collector layer in a first striped pattern;
depositing a channel semiconductor layer in a pattern such that multiple discrete regions of the channel semiconductor layer are disposed over first non-insulated portions of the current collector layer;
depositing a solid state electrolyte layer in a pattern of multiple discrete regions such that each discrete region of the solid state electrolyte contacts a region of the channel semiconductor layer;
depositing a layer of conductive material in discrete regions such that each discrete region of the conductive material layer makes contact with a discrete region of the channel semiconductor layer; and
depositing a gate electrode layer in a pattern of discrete regions such that each discrete region of the gate electrode layer contacts a discrete region of the solid state electrolyte layer and a discrete region of the conductive material layer or the current collector layer.
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