| CPC H10H 20/857 (2025.01) [H01L 25/0753 (2013.01); H01L 25/167 (2013.01); H10D 86/0214 (2025.01); H10D 86/441 (2025.01); H10D 86/60 (2025.01); H10H 20/018 (2025.01); H10H 20/812 (2025.01); H10H 29/14 (2025.01); H01L 25/0756 (2013.01); H10H 20/01335 (2025.01); H10H 20/0361 (2025.01); H10H 20/0364 (2025.01); H10H 20/825 (2025.01); H10H 20/8512 (2025.01); H10H 20/8514 (2025.01)] | 19 Claims |

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1. A method of fabricating an optoelectronic device, including an array of micro devices, comprising:
mounting a micro device layer, fabricated on a device substrate, onto a system substrate;
patterning the micro device layer to include raised contact sections over contact bumps after the mounting onto the system substrate; and
applying post bonding patterning of the micro device layer and a common electrode.
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