US 12,256,573 B2
Sensor package structure
Chia-Shuai Chang, Hsin-Chu County (TW); Chien-Hung Lin, Taipei (TW); Wen-Fu Yu, Taipei (TW); Wei-Li Wang, Taipei (TW); Bae-Yinn Hwang, Taipei (TW); and Jyun-Huei Jiang, Taipei (TW)
Assigned to TONG HSING ELECTRONIC INDUSTRIES, LTD., Taipei (TW)
Filed by TONG HSING ELECTRONIC INDUSTRIES, LTD., Taipei (TW)
Filed on Jun. 6, 2023, as Appl. No. 18/206,158.
Claims priority of application No. 112106566 (TW), filed on Feb. 23, 2023.
Prior Publication US 2024/0290897 A1, Aug. 29, 2024
Int. Cl. H10F 19/20 (2025.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H10F 19/80 (2025.01); H10F 77/30 (2025.01)
CPC H10F 19/20 (2025.01) [H01L 23/3114 (2013.01); H01L 23/3142 (2013.01); H01L 24/45 (2013.01); H10F 19/80 (2025.01); H10F 77/334 (2025.01)] 20 Claims
OG exemplary drawing
 
1. A sensor package structure, comprising:
a substrate;
a sensor chip disposed on and electrically coupled to the substrate, wherein a top surface of the sensor chip includes a sensing region and a peripheral region that is arranged outside of the sensing region, and wherein the sensing region defines a layout boundary and a plurality of sub-regions that are defined by the layout boundary and that are separate from each other;
a plurality of adhesive rings disposed on the sensing region, wherein each of the adhesive rings surrounds one of the sub-regions;
a plurality of filtering lenses respectively adhered to the adhesive rings, wherein each of the filtering lenses, a corresponding one of the adhesive rings, and a corresponding one of the sub-regions jointly define a buffering space, wherein M represents a quantity of the filtering lenses, the filtering lenses are configured to allow lights having N number of different wavelengths to pass therethrough, and wherein M and N are positive integers greater than one, and M is greater than or equal to N; and
an encapsulant being formed on the substrate and covering the peripheral region and the layout boundary of the sensor chip, wherein the sensor chip, the adhesive rings, and the filtering lenses are embedded in the encapsulant, and at least part of an outer surface of each of the filtering lenses is exposed from the encapsulant.