| CPC H05K 7/2039 (2013.01) [H05K 1/144 (2013.01); H05K 1/181 (2013.01); H05K 2201/042 (2013.01)] | 9 Claims |

|
1. A board unit comprising:
a board stack including a first circuit board and a second circuit board that are supported while being spaced apart from each other;
an electronic component mounted on the first circuit board;
a first heat dissipation member that covers the board stack from outside of the first circuit board;
a second heat dissipation member that covers the board stack from outside of the second circuit board;
a first heat transfer portion that thermally connects the electronic component and the first heat dissipation member; and
a second heat transfer portion that thermally connects the electronic component and the second circuit board,
wherein the electronic component has a body located between the first circuit board and the second circuit board,
the second heat transfer portion is partially provided at a position that corresponds to the body of the electronic component,
the second heat transfer portion includes a metal member,
the metal member includes a fixed portion fixed to the second circuit board, and a first protruding portion that protrudes from the second circuit board toward the body, and
the first protruding portion is not fixed to the electronic component.
|