US 12,256,522 B2
Heat dissipation device and electronic equipment
Xintong Ding, Beijing (CN); Puyu Yao, Beijing (CN); and Ting Tian, Beijing (CN)
Assigned to LENOVO (BEIJING) LIMITED, Beijing (CN)
Filed by Lenovo (Beijing) Limited, Beijing (CN)
Filed on Sep. 9, 2022, as Appl. No. 17/941,715.
Claims priority of application No. 202111640733.8 (CN), filed on Dec. 29, 2021.
Prior Publication US 2023/0209778 A1, Jun. 29, 2023
Int. Cl. H05K 7/20 (2006.01); H01L 23/367 (2006.01)
CPC H05K 7/2039 (2013.01) [H01L 23/367 (2013.01); H05K 7/20218 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A heat dissipation device, comprising:
a rigid tube, including a first cavity;
a first capillary structure, at least a portion of the first capillary structure being positioned within the first cavity;
a flexible tube, including a second cavity, the flexible tube being more flexible than the rigid tube; and
a second capillary structure being denser than the first capillary structure, at least a portion of the second capillary structure being positioned within the second cavity, and each end of the second capillary structure being connected with the first capillary structure,
wherein the heat dissipation device is deformable via the flexible tube.