US 12,256,521 B2
Apparatus for cooling electronic circuitry components and photonic components
Raffaele Luca Amalfi, New Providence, NJ (US); Stefano Grillanda, Springfield, NJ (US); and Ryan Enright, Floral Park, NY (US)
Assigned to Nokia Technologies Oy, Espoo (FI)
Filed by Nokia Technologies Oy, Espoo (FI)
Filed on Jul. 13, 2022, as Appl. No. 17/863,506.
Claims priority of application No. 21186594 (EP), filed on Jul. 20, 2021.
Prior Publication US 2023/0024390 A1, Jan. 26, 2023
Int. Cl. H05K 7/20 (2006.01); H01S 5/024 (2006.01)
CPC H05K 7/20336 (2013.01) [H01S 5/02415 (2013.01); H01S 5/02469 (2013.01)] 16 Claims
OG exemplary drawing
 
16. An apparatus comprising:
at least one electronic circuitry component;
at least one photonic component;
at least one electrical connection between the at least one electronic circuitry component and the at least one photonic component, wherein the at least one electrical connection is less than 300 micrometers;
at least one spacer located between an inner side of the at least one electronic circuitry component and an inner side of the at least one photonic component, wherein the at least one spacer is thermally insulating, wherein the at least one spacer comprises aerogel;
a first heat transfer member connected to the at least one electronic circuitry component at an outer side of the at least one electronic circuitry component, where the first heat transfer member is configured to remove heat from the at least one electronic circuitry component; and
a second heat transfer member connected to the at least one photonic component at an outer side of the at least one photonic component, where the second heat transfer member is configured to remove heat from the at least one photonic component, and where the second heat transfer member is spaced from the first heat transfer member.