US 12,256,514 B2
Power module with integrated gate driver and functional components within a single power module housing
Andre Arens, Rüthen (DE)
Assigned to INFINEON TECHNOLOGIES AG, Neubiberg (DE)
Filed by Infineon Technologies AG, Neubiberg (DE)
Filed on Nov. 30, 2021, as Appl. No. 17/537,959.
Prior Publication US 2023/0170791 A1, Jun. 1, 2023
Int. Cl. H02H 7/00 (2006.01); H01L 23/04 (2006.01); H05K 7/14 (2006.01); H02M 1/32 (2007.01); H02M 7/00 (2006.01); H02M 7/66 (2006.01)
CPC H05K 7/1432 (2013.01) [H01L 23/04 (2013.01); H02M 1/327 (2021.05); H02M 7/003 (2013.01); H02M 7/66 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An apparatus, comprising:
a power module housing including:
a conductive substrate;
a circuit board positioned overlying the conductive substrate, wherein the circuit board operates at a first voltage level and the conductive substrate operates at a second voltage level higher than the first voltage level;
an insulation material electrically insulating the conductive substrate from the circuit board;
a gate driver mounted to the circuit board;
at least one power device mounted to the conductive substrate and controlled by the gate driver; and
a monitoring component mounted to at least the conductive substrate and operatively coupled to the gate driver and the power device.