US 12,256,501 B2
Printed circuit board
In Gun Kim, Suwon-si (KR)
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on Apr. 14, 2023, as Appl. No. 18/134,697.
Claims priority of application No. 10-2022-0140031 (KR), filed on Oct. 27, 2022.
Prior Publication US 2024/0147634 A1, May 2, 2024
Int. Cl. H05K 3/46 (2006.01); H05K 1/11 (2006.01); H05K 1/14 (2006.01)
CPC H05K 3/465 (2013.01) [H05K 1/115 (2013.01); H05K 1/145 (2013.01); H05K 3/4682 (2013.01); H05K 2201/096 (2013.01); H05K 2203/1536 (2013.01)] 12 Claims
OG exemplary drawing
 
1. A printed circuit board, comprising:
a first insulating layer including a non-photosensitive insulating material;
a first wiring layer embedded in the first insulating layer, where an upper surface thereof is exposed from an upper surface of the first insulating layer, and which includes a first metal layer and a second metal layer covering at least a portion of each of lower surface and side surface of the first metal layer with a thickness thinner than the first metal layer; and
a second insulating layer disposed under the lower surface of the first insulating layer, covering at least a portion of a lower surface of the first wiring layer, and including the non-photosensitive insulating material,
wherein boundaries of the first and second insulating layers are separated from each other.