CPC H05K 3/28 (2013.01) [H05K 1/028 (2013.01); H05K 2201/10128 (2013.01)] | 20 Claims |
1. A driver substrate comprising:
a base substrate comprising a first bonding portion; and
a flexible circuit board disposed on a bonding surface of the first bonding portion and bending from the bonding surface to a side of the first bonding portion away from the bonding surface, wherein the flexible circuit board comprises a bent portion, an anti-scratch structure is disposed between the bent portion and the first bonding portion, and the bent portion is attached to the anti-scratch structure;
wherein the anti-scratch structure comprises a base portion and an anti-scratch portion, wherein the base portion and the base substrate are in integral formation with each other, the anti-scratch portion is disposed on a side of the base portion adjacent to the bent portion, the bent portion is attached to the anti-scratch portion, and the anti-scratch portion has an elastic modulus less than an elastic modulus of the base portion.
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