| CPC H05K 1/116 (2013.01) [H05K 3/0005 (2013.01); H05K 3/306 (2013.01); H05K 1/184 (2013.01)] | 25 Claims |

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1. A circuit board assembly comprising:
a multilayer circuit board with one or more apertures, the one or more apertures being configured to receive one or more connector pins, the multilayer circuit board being press-fit connectable via the one or more connector pins and
the multilayer circuit board including an internal clearance region in a layer of the multilayer circuit board adjacent an aperture of the one or more apertures with a modified voltage-to-ground clearance of conductive material based on configuration of a respective connector pin of the one or more connector pins to accommodate any deformation of the circuit board in a direction of greatest normal force outward from the aperture with insertion of the connector pin into the aperture.
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