US 12,256,493 B1
Rapid implementation of high-temperature analog interface electronics
Ian Getreu, Tigard, OR (US); James A. Holmes, Fayetteville, AR (US); Brandon Dyer, Prairie Grove, AR (US); Jacob Kupernik, Bella Vista, AR (US); Matthew Barlow, Springdale, AR (US); Nicholas Chiolino, Springdale, AR (US); and Anthony Matt Francis, Elkins, AR (US)
Filed by Ian Getreu, Tigard, OR (US); James A. Holmes, Fayetteville, AR (US); Brandon Dyer, Prairie Grove, AR (US); Jacob Kupernik, Bella Vista, AR (US); Matthew Barlow, Springdale, AR (US); Nicholas Chiolino, Springdale, AR (US); and Anthony Matt Francis, Elkins, AR (US)
Filed on Mar. 15, 2023, as Appl. No. 18/121,927.
Application 18/121,927 is a continuation in part of application No. 17/412,859, filed on Aug. 26, 2021, granted, now 11,647,582.
Int. Cl. H05K 1/11 (2006.01); G01V 1/18 (2006.01); H05K 1/18 (2006.01)
CPC H05K 1/112 (2013.01) [G01V 1/181 (2013.01); H05K 1/181 (2013.01); H05K 2201/09227 (2013.01); H05K 2201/09409 (2013.01); H05K 2201/09609 (2013.01); H05K 2201/10015 (2013.01); H05K 2201/10522 (2013.01)] 3 Claims
OG exemplary drawing
 
1. A ceramic wiring board for components, comprising:
a ceramic wiring board including a plurality of board layers defining a board surface and an internal section;
footprint arrays including component footprints for mounting the components on the board surface,
the component footprints connected through internal traces to the same position in a plurality of outrigger grids,
each outrigger grid having connection vias with sufficient spacing to allowing surface only additive manufacturing to connect selected vias thereby connecting the component footprints through their corresponding internal traces.