US 12,256,492 B2
Printed circuit board
Chan Hoon Ko, Suwon-si (KR); Ki Hee Cho, Suwon-si (KR); and Sang Hoon Kim, Suwon-si (KR)
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on Nov. 9, 2022, as Appl. No. 17/983,766.
Claims priority of application No. 10-2022-0053413 (KR), filed on Apr. 29, 2022.
Prior Publication US 2023/0354520 A1, Nov. 2, 2023
Int. Cl. H05K 1/11 (2006.01)
CPC H05K 1/111 (2013.01) [H05K 2201/2081 (2013.01)] 25 Claims
OG exemplary drawing
 
12. A printed circuit board comprising:
a first insulating layer;
a seed metal layer disposed on the first insulating layer;
a metal pad including a first metal portion disposed on the seed metal layer, and a second metal portion disposed on the first metal portion and integrated with the first metal portion without a boundary therebetween, the second metal portion having a width narrower than a width of the first metal portion on a cross-section; and
a second insulating layer disposed on the first insulating layer, the second insulating layer covering at least a portion of a side surface of the first metal portion and spaced apart from an upper surface of the first metal portion,
wherein a width of a portion of the seed metal layer being in contact with the first insulating layer is less than a width of the first metal portion.