US 12,256,491 B2
Electronic component mounting substrate, electronic component mounted body, and method of manufacturing the same, as well as electronic apparatus
Koji Aoyama, Aichi (JP); and Naoto Sasaki, Aichi (JP)
Assigned to Sony Group Corporation, Tokyo (JP)
Appl. No. 17/779,359
Filed by SONY GROUP CORPORATION, Tokyo (JP)
PCT Filed Dec. 1, 2020, PCT No. PCT/JP2020/044654
§ 371(c)(1), (2) Date May 24, 2022,
PCT Pub. No. WO2021/112073, PCT Pub. Date Jun. 10, 2021.
Claims priority of application No. 2019-219800 (JP), filed on Dec. 4, 2019.
Prior Publication US 2022/0408560 A1, Dec. 22, 2022
Int. Cl. H05K 1/11 (2006.01); H05K 1/18 (2006.01); H05K 3/00 (2006.01); H05K 3/02 (2006.01); H05K 3/34 (2006.01)
CPC H05K 1/111 (2013.01) [H05K 1/181 (2013.01); H05K 3/0032 (2013.01); H05K 3/027 (2013.01); H05K 3/3442 (2013.01); H05K 3/3494 (2013.01); H05K 2201/09381 (2013.01); H05K 2201/10015 (2013.01); H05K 2201/10022 (2013.01); H05K 2201/1003 (2013.01); H05K 2201/10037 (2013.01); H05K 2201/10166 (2013.01); H05K 2201/10174 (2013.01); H05K 2203/107 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An electronic component mounted body, comprising:
a substrate;
a connection section provided on the substrate;
an electronic component having a terminal connected to the connection section; and
a solder that fixes the electronic component to the connection section,
wherein the connection section comprises:
a first region in which the terminal is fixed by the solder; and
a second region lower in wettability than the first region,
wherein the second region comprises:
an extension region extended to a peripheral edge of the connection section; and
a spaced region that projects from the extension region toward the first region and that is provided to be spaced from the peripheral edge,
wherein a surface of the substrate is provided with a laser processed region adjacent to the extension region, and
wherein a width of the laser processed region is equal to a width of the extension region.