US 12,256,490 B2
Prepreg, laminate, and production methods therefor, as well as printed circuit board and semiconductor package
Mari Shimizu, Tokyo (JP); Daisuke Fujimoto, Tokyo (JP); Yasuo Kamigata, Tokyo (JP); Tomohiko Kotake, Tokyo (JP); Shin Takanezawa, Tokyo (JP); Akira Shimizu, Tokyo (JP); Harumi Negishi, Tokyo (JP); Kouichi Aoyagi, Tokyo (JP); and Sayaka Kikuchi, Tokyo (JP)
Assigned to RESONAC CORPORATION, Tokyo (JP)
Appl. No. 16/770,484
Filed by HITACHI CHEMICAL COMPANY, LTD., Tokyo (JP)
PCT Filed Dec. 10, 2018, PCT No. PCT/JP2018/045309
§ 371(c)(1), (2) Date Jun. 5, 2020,
PCT Pub. No. WO2019/112066, PCT Pub. Date Jun. 13, 2019.
Claims priority of application No. PCT/JP2017/044256 (WO), filed on Dec. 8, 2017.
Prior Publication US 2020/0404783 A1, Dec. 24, 2020
Int. Cl. H05K 1/03 (2006.01); B29B 15/08 (2006.01); B29B 15/10 (2006.01); B29B 15/12 (2006.01); B29B 15/14 (2006.01); B29C 70/06 (2006.01); C08G 59/40 (2006.01); C08J 5/04 (2006.01); C08J 5/24 (2006.01); H05K 3/46 (2006.01)
CPC H05K 1/0306 (2013.01) [B29B 15/08 (2013.01); B29B 15/10 (2013.01); B29B 15/12 (2013.01); B29B 15/14 (2013.01); B29C 70/06 (2013.01); C08G 59/40 (2013.01); C08J 5/04 (2013.01); C08J 5/244 (2021.05); H05K 3/4629 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A prepreg for forming a laminate used in a semiconductor package, the prepreg comprising glass fibers and a thermosetting resin composition, which contains a layer of plural glass fiber filaments aligned to run nearly parallel to each other in one direction,
wherein the prepreg does not contain a glass fiber bundle of 50 or more glass fiber filaments bundled, or contains such glass fiber bundles, but the content thereof is 10% by volume or less relative to the total amount of the glass fibers in the prepreg, and
wherein the prepreg has a property that, when a plurality of the prepregs are provided in layers in a laminate that contains a layer of plural glass fiber filaments aligned to run nearly parallel to each other in one direction, and a layer of plural glass fiber filaments aligned to run nearly parallel to each other in the other one direction different from the previous one direction, the laminate has a bending elastic modulus at 25° C. of 35 GPa or more.