US 12,256,486 B2
Shield structure in electronic device and operation method thereof
Jonghyuk Kim, Suwon-si (KR); Sangdeok Lee, Suwon-si (KR); and Woosung Choi, Suwon-si (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed on Mar. 1, 2023, as Appl. No. 18/115,992.
Application 18/115,992 is a continuation of application No. PCT/KR2022/007953, filed on Jun. 3, 2022.
Claims priority of application No. 10-2021-0072898 (KR), filed on Jun. 4, 2021.
Prior Publication US 2023/0209700 A1, Jun. 29, 2023
Int. Cl. H05K 1/02 (2006.01); H05K 1/18 (2006.01); H05K 9/00 (2006.01)
CPC H05K 1/0216 (2013.01) [H05K 1/181 (2013.01); H05K 9/0024 (2013.01); H05K 2201/10053 (2013.01); H05K 2201/1006 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An electronic device comprising:
a printed circuit board (PCB); and
a package disposed at the printed circuit board,
wherein the package comprises:
a ground pad and at least one shield pad connected the printed circuit board;
a laminated structure comprising a plurality of laminated ground layers electrically connected to the ground pad by at least one via hole;
at least one electronic component disposed at an uppermost surface of the laminated structure;
a shield covering the at least one electronic; and
at least one switch device comprising a switch disposed at the uppermost surface of the laminated structure,
wherein the at least one switch device comprises a first terminal electrically connected to the shield through a first conductor wiring, a second terminal electrically connected to at least one of the pluralities of ground layers through a second conductor wiring, and a third terminal electrically connected to the shield pad through a third conductor wiring, and
wherein the at least one switch device is configured to selectively connect the first terminal to the second terminal or the third terminal wherein the shield is connected to at least one of the at least one of the pluralities of ground layers or the shield pad.