US 12,256,190 B2
Speaker module and electronic device including the same
Seongkwan Yang, Suwon-si (KR); Kiwon Kim, Suwon-si (KR); Choonghyo Park, Suwon-si (KR); Jihoon Song, Suwon-si (KR); Peng Zhang, Shandong (CN); Guodong Zhao, Shandong (CN); Kyudong Kim, Incheon (KR); Byounghee Lee, Suwon-si (KR); and Hochul Hwang, Suwon-si (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR); and GOERTEK INC, Shandong (CN)
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR); and GOERTEK INC, Shandong (CN)
Filed on Aug. 19, 2022, as Appl. No. 17/891,993.
Application 17/891,993 is a continuation of application No. PCT/CN2020/076244, filed on Feb. 21, 2020.
Prior Publication US 2022/0394375 A1, Dec. 8, 2022
Int. Cl. H04R 1/28 (2006.01); G06F 1/16 (2006.01)
CPC H04R 1/288 (2013.01) [G06F 1/1633 (2013.01); H04R 1/2811 (2013.01); H04R 2499/11 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A speaker module, comprising:
a speaker housing including an internal space and a conduit adjacent to the internal space and extending to the internal space, and the internal space including a first region and a second region partitioned from the first region;
a speaker component positioned in the first region;
a vent hole spaced apart from the speaker component and passing through at least part of the speaker housing corresponding to the second region of the internal space;
a sound absorbing material disposed in the second region to be positioned adjacent to the speaker component; and
a guide structure disposed to surround the vent hole and including at least one protrusion protruding towards the internal space,
wherein the guide structure includes a plurality of openings formed in a front surface of the guide structure and a side surface of the guide structure and extending to the vent hole.