US 12,255,622 B2
Acoustic wave devices with common ceramic substrate
Kwang Jae Shin, Yongin (KR); and Hiroyuki Nakamura, Osaka-Fu (JP)
Assigned to Skyworks Global Pte. Ltd., Singapore (SG)
Filed by Skyworks Global Pte. Ltd., Singapore (SG)
Filed on Jul. 29, 2022, as Appl. No. 17/877,075.
Application 17/877,075 is a continuation of application No. 16/726,107, filed on Dec. 23, 2019, granted, now 11,424,732.
Claims priority of provisional application 62/785,906, filed on Dec. 28, 2018.
Claims priority of provisional application 62/785,958, filed on Dec. 28, 2018.
Prior Publication US 2022/0368311 A1, Nov. 17, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. H03H 9/56 (2006.01); H03H 9/13 (2006.01); H03H 9/145 (2006.01); H03H 9/17 (2006.01); H03H 9/25 (2006.01); H03H 9/54 (2006.01); H03H 9/64 (2006.01); H03H 9/70 (2006.01); H03H 9/72 (2006.01)
CPC H03H 9/56 (2013.01) [H03H 9/13 (2013.01); H03H 9/145 (2013.01); H03H 9/17 (2013.01); H03H 9/171 (2013.01); H03H 9/25 (2013.01); H03H 9/54 (2013.01); H03H 9/64 (2013.01); H03H 9/703 (2013.01); H03H 9/72 (2013.01)] 21 Claims
OG exemplary drawing
 
1. An acoustic wave component comprising:
a bulk acoustic wave resonator including an air cavity between at least a portion of a ceramic substrate and at least one electrode; and
a surface acoustic wave device disposed in the air cavity, the surface acoustic wave device including a piezoelectric layer above the ceramic substrate, and an interdigital transducer electrode above the piezoelectric layer.