US 12,255,620 B2
Electronic component
Toru Yamaji, Nagaokakyo (JP)
Assigned to MURATA MANUFACTURING CO., LTD., Kyoto (JP)
Filed by Murata Manufacturing Co., Ltd., Nagaokakyo (JP)
Filed on Sep. 27, 2022, as Appl. No. 17/953,380.
Application 17/953,380 is a continuation of application No. PCT/JP2021/011423, filed on Mar. 19, 2021.
Claims priority of application No. 2020-061032 (JP), filed on Mar. 30, 2020.
Prior Publication US 2023/0017921 A1, Jan. 19, 2023
Int. Cl. H03H 9/25 (2006.01); H01L 23/10 (2006.01); H01L 23/31 (2006.01); H03H 9/02 (2006.01); H03H 9/05 (2006.01); H03H 9/10 (2006.01)
CPC H03H 9/25 (2013.01) [H01L 23/10 (2013.01); H01L 23/3114 (2013.01); H03H 9/02015 (2013.01); H03H 9/0504 (2013.01); H03H 9/1007 (2013.01)] 19 Claims
OG exemplary drawing
 
1. An electronic component, comprising:
a mounting substrate;
a first device spaced apart from the mounting substrate and facing the mounting substrate; and
a second device located on the mounting substrate so as to face the first device; wherein
each of the first device and the second device includes a functional element;
the functional element of the first device is located on a first surface facing the second device, in the first device;
the functional element of the second device is located on a second surface facing the first device, in the second device;
the first device is connected to a first electrode on the mounting substrate via a first bonding member;
the second device is connected to a second electrode on the mounting substrate via a second bonding member; and
in a normal direction of the mounting substrate, a distance in at least a portion of the second electrode to the first surface of the first device is longer than a distance from the first electrode to the first surface of the first device.