US 12,255,615 B2
Electronic component
Marc Esquius Morote, Munich (DE)
Assigned to RF360 Singapore Pte. Ltd., Singapore (SG)
Appl. No. 17/294,595
Filed by RF360 Singapore Pte. Ltd., Republic Plaza (SG)
PCT Filed Dec. 13, 2019, PCT No. PCT/EP2019/085064
§ 371(c)(1), (2) Date May 17, 2021,
PCT Pub. No. WO2020/126902, PCT Pub. Date Jun. 25, 2020.
Claims priority of application No. 10 2018 132 695.5 (DE), filed on Dec. 18, 2018.
Prior Publication US 2021/0408998 A1, Dec. 30, 2021
Int. Cl. H03H 9/145 (2006.01); H03H 9/25 (2006.01); H03H 9/64 (2006.01)
CPC H03H 9/145 (2013.01) [H03H 9/25 (2013.01); H03H 9/64 (2013.01)] 14 Claims
OG exemplary drawing
 
1. An electronic component comprising:
a piezoelectric substrate; and
an interdigital capacitor on top of the piezoelectric substrate, wherein:
the interdigital capacitor comprises two electrodes, each electrode of the two electrodes comprising a plurality of fingers;
each finger of the plurality of fingers comprise an associated first metal layer;
at least some fingers of the plurality of fingers comprise an associated second metal layer on top of the associated first metal layer; and
for each finger of the plurality of fingers comprising the associated first metal layer and the associated second metal layer, a width of a finger in a region of the associated first metal layer is larger than a width of a finger in a region of the associated second metal layer,
wherein, in different fingers of the plurality of fingers, the associated second metal layer and the associated first metal layer are arranged differently with respect to each other.