US 12,255,613 B2
Multi-layer piezoelectric substrate with conductive layer
Rei Goto, Osaka (JP); and Keiichi Maki, Suita (JP)
Assigned to Skyworks Solutions, Inc., Irvine, CA (US)
Filed by Skyworks Solutions, Inc., Irvine, CA (US)
Filed on Apr. 19, 2023, as Appl. No. 18/303,012.
Application 18/303,012 is a continuation of application No. 16/723,819, filed on Dec. 20, 2019, granted, now 11,671,072.
Claims priority of provisional application 62/785,011, filed on Dec. 26, 2018.
Prior Publication US 2023/0370044 A1, Nov. 16, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. H03H 9/02 (2006.01); H03H 3/08 (2006.01); H03H 9/13 (2006.01); H03H 9/54 (2006.01); H03H 9/64 (2006.01); H03H 9/72 (2006.01); H10N 30/05 (2023.01); H10N 30/50 (2023.01); H10N 30/87 (2023.01)
CPC H03H 9/02913 (2013.01) [H03H 3/08 (2013.01); H03H 9/02559 (2013.01); H03H 9/02574 (2013.01); H03H 9/02834 (2013.01); H03H 9/131 (2013.01); H03H 9/54 (2013.01); H03H 9/6406 (2013.01); H03H 9/725 (2013.01); H10N 30/05 (2023.02); H10N 30/50 (2023.02); H10N 30/87 (2023.02)] 20 Claims
OG exemplary drawing
 
1. An acoustic wave resonator comprising:
a piezoelectric layer over a substrate, the piezoelectric layer having at least one etched portion along a side;
an interdigital transducer electrode over the piezoelectric layer;
a grounding structure over at least a portion of the interdigital transducer electrode; and
a conductive layer with at least a portion positioned between the interdigital transducer electrode and the substrate, the conductive layer electrically connected to the grounding structure by way of conductive material in the at least one etched portion of the piezoelectric layer.