US 12,255,424 B2
Electrical interposer with shielded contacts and shielding ground plane with optimized impedance response
John Williams, Austin, TX (US)
Assigned to GITech, Inc., Austin, TX (US)
Filed by GITech, Inc., Austin, TX (US)
Filed on Dec. 22, 2023, as Appl. No. 18/393,715.
Application 18/393,715 is a continuation of application No. 18/186,148, filed on Mar. 18, 2023, granted, now 11,870,185.
Application 18/186,148 is a continuation of application No. 17/243,960, filed on Apr. 29, 2021, granted, now 11,626,696, issued on Apr. 11, 2023.
Prior Publication US 2024/0128690 A1, Apr. 18, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. H01R 13/6587 (2011.01); H01R 4/24 (2018.01); H01R 13/24 (2006.01)
CPC H01R 13/6587 (2013.01) [H01R 4/24 (2013.01); H01R 13/2492 (2013.01)] 12 Claims
OG exemplary drawing
 
1. An interposer connector for electrically coupling conductive structures formed on a first electronic component to conductive structures formed on a second electronic component, the interposer comprising:
a first set of signal contact elements provided on a first major surface of a first isolation layer;
a first set of ground contact elements provided on the first major surface of the first isolation layer, the ground contact elements being periodically placed between signal contact elements but electrically isolated from the respective signal contact elements; and
a first conductive layer provided adjacent to and having a first major surface in contact with a second major surface of the first isolation layer, the first conductive layer being electrically connected to at least some of the ground contact elements by conductive conduits formed in the first isolation layer,
wherein a first spacing along the first major surface of the first isolation layer between adjacent pairs of signal contact elements and a second spacing between the first set of signal contact elements and the first conductive layer are selected to obtain a given impedance response of the signal contact elements.