CPC H01Q 21/29 (2013.01) [H01Q 1/247 (2013.01)] | 22 Claims |
1. A modular RF system comprising:
a first module enclosure configured to house a first plurality of modules;
one or more antennas coupled to the module enclosure on one or more exterior surfaces of the module enclosure and configured to receive RF signals and transmit RF signals;
a first channel extending from a bottom portion of the first module enclosure, through an interior portion of the first module enclosure, to a top portion of the first module enclosure;
a first one or more heat sinks positioned within the first channel and thermally coupled to the first plurality of modules; and
at least one fan positioned at a top or a bottom of the first module enclosure and configured to cause air to flow through the first channel and the first one or more heat sinks.
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