US 12,255,381 B2
Antenna modules employing three-dimensional (3D) build-up on mold package to support efficient integration of radio-frequency (RF) circuitry, and related fabrication methods
Ranadeep Dutta, Del Mar, CA (US); Jonghae Kim, San Diego, CA (US); and Je-Hsiung Lan, San Diego, CA (US)
Assigned to QUALCOMM Incorporated, San Diego, CA (US)
Filed by QUALCOMM Incorporated, San Diego, CA (US)
Filed on Feb. 24, 2022, as Appl. No. 17/652,328.
Prior Publication US 2023/0268637 A1, Aug. 24, 2023
Int. Cl. H01Q 1/22 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/367 (2006.01); H01L 23/538 (2006.01); H01L 23/552 (2006.01); H01L 23/66 (2006.01); H01L 25/00 (2006.01); H01L 25/10 (2006.01)
CPC H01Q 1/2283 (2013.01) [H01L 21/4853 (2013.01); H01L 21/4857 (2013.01); H01L 21/565 (2013.01); H01L 23/3121 (2013.01); H01L 23/3672 (2013.01); H01L 23/5383 (2013.01); H01L 23/5386 (2013.01); H01L 23/5389 (2013.01); H01L 23/552 (2013.01); H01L 23/66 (2013.01); H01L 24/19 (2013.01); H01L 24/20 (2013.01); H01L 25/105 (2013.01); H01L 25/50 (2013.01); H01L 2223/6616 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/214 (2013.01); H01L 2225/1035 (2013.01); H01L 2225/107 (2013.01); H01L 2225/1094 (2013.01)] 23 Claims
OG exemplary drawing
 
1. An antenna module, comprising:
a first die package, comprising:
a first mold layer encapsulating a first die having a first active face; and
a first isolation layer adjacent to the first mold layer and the first active face of the first die, the first isolation layer comprising a first interconnect coupled to the first active face of the first die and exposed through a first surface of the first isolation layer; and
a second die package, comprising:
a second mold layer encapsulating a second die having a second active face, wherein the second mold layer is disposed in a first plane in a horizontal direction;
a metal shield disposed in the second mold layer, the metal shield at least partially surrounding the second die in the first plane; and
a second isolation layer adjacent to the second mold layer and the second active face of the second die, the second isolation layer comprising a second interconnect coupled to the second active face of the second die and exposed through a second surface of the second isolation layer;
the second surface of the second isolation layer coupled to the first surface of the first isolation layer to couple the first interconnect to the second interconnect.