US 12,255,279 B2
Light-emitting diode package structure and manufacturing method thereof
Wen-Yu Lin, Taichung (TW); and Kai-Ming Yang, Hsinchu County (TW)
Assigned to Unimicron Technology Corp., Taoyuan (TW)
Filed by Unimicron Technology Corp., Taoyuan (TW)
Filed on Jan. 25, 2022, as Appl. No. 17/583,222.
Claims priority of application No. 110146669 (TW), filed on Dec. 14, 2021.
Prior Publication US 2023/0187598 A1, Jun. 15, 2023
Int. Cl. H01L 33/64 (2010.01); H01L 25/075 (2006.01); H01L 33/22 (2010.01); H01L 33/48 (2010.01); H01L 33/62 (2010.01)
CPC H01L 33/647 (2013.01) [H01L 25/0753 (2013.01); H01L 33/22 (2013.01); H01L 33/483 (2013.01); H01L 33/62 (2013.01); H01L 2933/0066 (2013.01); H01L 2933/0075 (2013.01)] 5 Claims
OG exemplary drawing
 
1. A manufacturing method of a light-emitting diode package structure comprising:
forming a plurality of light-emitting diodes on a first temporary substrate;
forming a redistribution layer on the light-emitting diodes to be electrically connected to the light-emitting diodes; and
forming a heat dissipation substrate on the redistribution layer, wherein the heat dissipation substrate comprises a plurality of copper blocks and a heat-conducting material layer, and the copper blocks penetrate the heat-conducting material layer and are electrically connected to the redistribution layer,
wherein a side of the light-emitting diodes away from the redistribution layer is not in contact with any component,
wherein before forming the redistribution layer on the light-emitting diodes further comprises:
forming a protective layer on the first temporary substrate to fill a gap between the light-emitting diodes, and to surround each of the light-emitting diodes.