US 12,255,277 B2
Element substrate, light-emitting element module, and light-emitting device
Ryota Hasunuma, Higashiomi (JP)
Assigned to KYOCERA CORPORATION, Kyoto (JP)
Appl. No. 17/598,298
Filed by KYOCERA CORPORATION, Kyoto (JP)
PCT Filed Mar. 19, 2020, PCT No. PCT/JP2020/012508
§ 371(c)(1), (2) Date Sep. 27, 2021,
PCT Pub. No. WO2020/203372, PCT Pub. Date Oct. 8, 2020.
Claims priority of application No. 2019-068609 (JP), filed on Mar. 29, 2019.
Prior Publication US 2022/0181532 A1, Jun. 9, 2022
Int. Cl. H01L 33/62 (2010.01); H01L 33/64 (2010.01)
CPC H01L 33/62 (2013.01) [H01L 33/641 (2013.01); H01L 33/642 (2013.01)] 11 Claims
OG exemplary drawing
 
1. An element substrate, comprising:
an insulating substrate comprising ceramics, the insulating substrate including a first surface and a second surface opposite to the first surface;
electrode wiring located on the first surface and electrically connectable to an element mounted on the first surface;
a heat-dissipating member in contact with the second surface, the heat-dissipating member including an extending portion extending from the insulating substrate;
a flexible substrate electrically connected to the electrode wiring, and having a facing surface facing the extending portion of the heat-dissipating member and facing the first surface of the insulating substrate, wherein the flexible substrate has a resin film and signal wiring is located on a surface of the resin film;
a temperature detecting element located on the facing surface; and
an adhesive layer located at least between the temperature detecting element and the heat-dissipating member or between the facing surface and the heat-dissipating member,
wherein
the resin film is strip-shaped,
the signal wiring includes a pair of wires extending in a longitudinal direction of the resin film, and
the temperature detecting element is located between the pair of wires in a width direction of the resin film.
 
11. An element substrate, comprising:
an insulating substrate comprising ceramics, the insulating substrate including a first surface and a second surface opposite to the first surface;
electrode wiring located on the first surface and electrically connectable to an element;
a heat-dissipating member in contact with the second surface;
a flexible substrate electrically connected to the electrode wiring, and having a facing surface facing the heat-dissipating member or facing the insulating substrate;
a temperature detecting element located on the facing surface; and
an adhesive layer located at least between the temperature detecting element and the heat-dissipating member or between the facing surface and the heat-dissipating member,
wherein
the flexible substrate includes a resin film that is strip-shaped and signal wiring located on a surface of the resin film,
the signal wiring includes a pair of wires extending in a longitudinal direction of the resin film, and
the temperature detecting element is located between the pair of wires in a width direction of the resin film.